H Hygon China Last verified

海光 DCU K100

OAM In production Released 2024 hygon-dcu-gen3
BF16
TFLOP/s
192 厂商声称
FP8
TFLOP/s
unsupported
FP4
TFLOP/s
unsupported
Memory
GB
96 厂商声称
Mem BW
GB/s
2400 厂商声称
TDP
W
600 厂商声称

Full specs

Compute

FP4 TFLOPS
unsupported
FP8 TFLOPS
unsupported
BF16 TFLOPS
192
FP16 TFLOPS
192
INT8 TOPS
384

Memory

Capacity
96 GB
Bandwidth
2400 GB/s
Type
HBM3

Die architecture 🟢 vendor floorplan

CU count
96
HBM stacks
6
Process
6 nm
PCIe
Gen 5 ×16

Scale-Up (intra-node)

Protocol
Hygon-Link
Per-link BW
400 GB/s
World size
8
Topology
fully-connected
Switch

Scale-Out (inter-node)

Per-card NIC
200 Gbps
Protocol
RoCEv2
NIC

Topology

拓扑结构 · Topology
8 卡 scale-up domain
芯片内部 / Die-level architecture
HBM HBM HBM HBM HBM HBM 海光 DCU K100 L2 / shared cache · NoC L1$ / register file (per CU) 96 CUs · darker block = tensor / matrix engine 192 TFLOPS BF16 · 96 GB HBM3 @ 2.4 TB/s · 600 W TDP

🟢 vendor floorplan 96 CUs · 6× HBM · 6 nm


集群拓扑 / Cluster topology · Hygon-Link @ 400 GB/s
Hygon-Link switch 400 GB/s/link · all-to-all GPU 0 96GB GPU 1 96GB GPU 2 96GB GPU 3 96GB GPU 4 96GB GPU 5 96GB GPU 6 96GB GPU 7 96GB 8 cards · fully-connected topology · scale-out: 200 Gbps/card
Scale-Up · 域内
Hygon-Link
400 GB/s · 拓扑: fully-connected
world_size = 8
Scale-Out · 跨域
RoCEv2
200 Gbps/卡 NIC

Which models can it run?

Quick estimates · decode tok/s/card 上界

TP=8 · BF16 · batch=16 · prefill=1024 · decode=256 · 已应用 efficiency 校准

在计算器中调整 →
模型 参数 (active) Decode tok/s/card 瓶颈
DeepSeek V4 Pro
deepseek
49B 显存不足
DeepSeek V4 Flash
deepseek
13B 205 内存带宽
Mistral Small 4
mistral
22B 93 内存带宽
GLM-5 Reasoning
zhipu
32B 77 内存带宽
GLM-5.1
zhipu
32B 显存不足
Qwen3.6 Plus
alibaba
35B 显存不足
Kimi K2.6
moonshot
32B 显存不足
MiniMax M2.7
minimax
46B 显存不足

Operator-level fit · per-model bottleneck + upper bound

算子级 fit · operator-level fit (per-token roofline)

基于每个模型 operator_decomposition + 本卡 BF16 192 TFLOPS / 2,400 GB/s 计算 · ridge point ≈ 80 FLOPs/byte

上界 = min(计算屋顶, 内存带宽屋顶) · efficiency 未应用
模型 domain 主导算子 AI · F/B 瓶颈 tok/s 上界
DeepSeek V4 Pro llm matmul 245.5 🔥 计算 32k
GraphCast scientific graph-message-passing 0.9 💾 内存带宽 4428
AlphaFold 3 scientific pair-bias-attention 2.3 💾 内存带宽 1330
GPT-OSS llm matmul 0.7 💾 内存带宽 194
Gemma 4 26B llm matmul 0.7 💾 内存带宽 144
DeepSeek V4 Flash llm matmul 0.8 💾 内存带宽 136
Mistral Small 4 llm matmul 0.6 💾 内存带宽 62
Llama 4 Maverick llm matmul 0.8 💾 内存带宽 61
需要 efficiency 校准 + concurrency 扫描 + TCO 估算 → 在计算器中评估 →

Operator support & optimization headroom

算子支持 & 优化空间 / Operator support & headroom

Per-operator support derived from software_support.engines + scale-up topology. Optimization headroom from measured efficiency factor.

Optimization headroom
+-50 pp
saturated

Near saturation at 150% of roofline. Further gains require workload restructure (disaggregated, speculative, smaller batch).

Communication (collective)
All-to-All 🟢 mature
all-to-all via Hygon-Link world_size=8
AllReduce 🟢 mature
Hygon-Link ring all-reduce
Attention
Multi-Head Attention 🟢 mature
paged-attention via vLLM/SGLang/MindIE
FlashAttention-3 🔴 gap
No FA-3 path; falls back to FA-2 / vanilla SDPA
Matrix multiply (GEMM)
Matrix Multiplication 🟢 mature
GEMM supported on all inference engines
MoE routing
MoE Routing 🟢 mature
MoE gating supported via vLLM ≥0.4 / SGLang
Normalization
RMSNorm 🟢 mature
fused into engine kernels
Embedding
fused into engine kernels
Activation
SiLU / Swish 🟢 mature
fused into engine kernels
Softmax 🟢 mature
fused into engine kernels

Software-stack support

Engine Status BF16FP16FP4FP8 E4M3FP8 E5M2INT4 AWQ
HanGuangAI unconfirmed
LMDeploy unconfirmed
MindIE unconfirmed
MoRI unconfirmed
SGLang unconfirmed
TensorRT-LLM (Dynamo) unconfirmed
vLLM community
Measured efficiency factor

Computed from 1 measured cases for this card. The calculator uses this value in place of the default 0.5.

1.50
measured / theoretical (n=1)

Existing deployment cases (1)

Citations

  1. [1] Hygon K100 announcement (vendor-claimed; details still emerging) — https://www.hygon.cn/ · accessed 2026-04-28 厂商声称
  2. [2] K100 (深算二号): GCN-derived gen3, 96 CUs, 6× HBM3 ⇒ 96 GB; SMIC 6nm-class, PCIe Gen5 x16 — https://www.hygon.cn/ · accessed 2026-04-28 社区估算
⚠ All performance figures are vendor-claimed unless tier=measured.
⚠ Some specs derived from supply-chain reports.