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NVIDIA R200 SXM (Vera Rubin)

SXM announced Released 2026 rubin-gen1
BF16
TFLOP/s
7500 厂商声称
FP8
TFLOP/s
15000 厂商声称
FP4
TFLOP/s
30000 厂商声称
Memory
GB
288 厂商声称
Mem BW
GB/s
13000 厂商声称
TDP
W
1800 厂商声称

Full specs

Compute

FP4 TFLOPS
30000
FP8 TFLOPS
15000
BF16 TFLOPS
7500
FP16 TFLOPS
7500
INT8 TOPS
15000

Memory

Capacity
288 GB
Bandwidth
13000 GB/s
Type
HBM4

Die architecture 🟢 vendor floorplan

SM count
200
Tensor cores / SM
4
L2 cache
128 MB
HBM stacks
8
Process
3 nm
PCIe
Gen 6 ×16

Scale-Up (intra-node)

Protocol
NVLink-6.0
Per-link BW
3600 GB/s
World size
144
Topology
switched
Switch
nvswitch-gen5

Scale-Out (inter-node)

Per-card NIC
1600 Gbps
Protocol
InfiniBand-XDR
NIC
ConnectX-9

Topology

拓扑结构 · Topology
144 卡 scale-up domain
芯片内部 / Die-level architecture
HBM HBM HBM HBM HBM HBM HBM HBM NVIDIA R200 SXM (Vera Rubin) L2 / shared cache · NoC L1$ / register file (per SM) 200 SMs · darker block = tensor / matrix engine 7500 TFLOPS BF16 · 15000 FP8 · 288 GB HBM4 @ 13.0 TB/s · 1800 W TDP

🟢 vendor floorplan 200 SMs · 8× HBM · 128 MB L2 · 3 nm


集群拓扑 / Cluster topology · NVLink-6.0 @ 3600 GB/s
Spine (NVLink-6.0 fabric) Leaf switches N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 N15 N16 N17 N18 Super-pod (rack-scale) · 144 cards in single scale-up domain · 3600 GB/s/link · 2-tier Clos fabric
Scale-Up · 域内
NVLink-6.0
3600 GB/s · 拓扑: switched
world_size = 144
Scale-Out · 跨域
InfiniBand-XDR
1600 Gbps/卡 NIC
ConnectX-9

Which models can it run?

Quick estimates · decode tok/s/card 上界

TP=8 · FP4 · batch=16 · prefill=1024 · decode=256 · 已应用 efficiency 校准

在计算器中调整 →
模型 参数 (active) Decode tok/s/card 瓶颈
DeepSeek V4 Pro
deepseek
49B 265,306 内存带宽
DeepSeek V4 Flash
deepseek
13B 370 内存带宽
Mistral Small 4
mistral
22B 168 内存带宽
GLM-5 Reasoning
zhipu
32B 139 内存带宽
GLM-5.1
zhipu
32B 95 内存带宽
Qwen3.6 Plus
alibaba
35B 91 内存带宽
Kimi K2.6
moonshot
32B 78 内存带宽
MiniMax M2.7
minimax
46B 61 内存带宽

Operator-level fit · per-model bottleneck + upper bound

算子级 fit · operator-level fit (per-token roofline)

基于每个模型 operator_decomposition + 本卡 BF16 7,500 TFLOPS / 13,000 GB/s 计算 · ridge point ≈ 577 FLOPs/byte

上界 = min(计算屋顶, 内存带宽屋顶) · efficiency 未应用
模型 domain 主导算子 AI · F/B 瓶颈 tok/s 上界
DeepSeek V4 Pro llm matmul 245.5 💾 内存带宽 531k
GraphCast scientific graph-message-passing 0.9 💾 内存带宽 24k
AlphaFold 3 scientific pair-bias-attention 2.3 💾 内存带宽 7206
GPT-OSS llm matmul 0.7 💾 内存带宽 1051
Gemma 4 26B llm matmul 0.7 💾 内存带宽 781
DeepSeek V4 Flash llm matmul 0.8 💾 内存带宽 739
Mistral Small 4 llm matmul 0.6 💾 内存带宽 337
Llama 4 Maverick llm matmul 0.8 💾 内存带宽 333
需要 efficiency 校准 + concurrency 扫描 + TCO 估算 → 在计算器中评估 →

Operator support & optimization headroom

算子支持 & 优化空间 / Operator support & headroom

Per-operator support derived from software_support.engines + scale-up topology. Optimization headroom from measured efficiency factor.

Optimization headroom
+50 pp
moderate

No cases yet — using default 0.5 efficiency. Real headroom unknown until first measurement lands.

Communication (collective)
All-to-All 🟢 mature
all-to-all via NVLink-6.0 world_size=144
AllReduce 🟢 mature
NVLink-6.0 ring all-reduce
Attention
Multi-Head Attention 🟢 mature
paged-attention via vLLM/SGLang/MindIE
FlashAttention-3 🟢 mature
FA-3 on modern engine + tensor cores
Matrix multiply (GEMM)
Matrix Multiplication 🟢 mature
GEMM supported on all inference engines
MoE routing
MoE Routing 🟢 mature
MoE gating supported via vLLM ≥0.4 / SGLang
Normalization
RMSNorm 🟢 mature
fused into engine kernels
Embedding
fused into engine kernels
Activation
SiLU / Swish 🟢 mature
fused into engine kernels
Softmax 🟢 mature
fused into engine kernels

Software-stack support

Engine Status BF16FP16FP4FP8 E4M3FP8 E5M2INT4 AWQ
HanGuangAI unconfirmed
LMDeploy unconfirmed
MindIE unconfirmed
MoRI unconfirmed
SGLang unconfirmed
TensorRT-LLM (Dynamo) official
vLLM official

Existing deployment cases (0)

No measured cases yet for this card. Be the first contributor?

Citations

  1. [1] NVIDIA Rubin announcement (Computex 2025): NVLink-6.0 at 3.6 TB/s, NVL144 rack-scale, HBM4 with 288 GB / 13 TB/s. Vendor-claimed; not yet GA. — https://www.nvidia.com/en-us/data-center/rubin/ · accessed 2026-04-29 厂商声称
  2. [2] Rubin die: 200 SMs enabled, 128 MB L2, dual-die package on TSMC 3nm. Specs estimated from public roadmap; subject to change at GA. — https://www.semianalysis.com/p/rubin-architecture-deep-dive · accessed 2026-04-29 社区估算
⚠ Status: announced — not yet in customer hands. Specs sourced from Computex 2025 keynote; subject to revision at GA.
⚠ NVL144 super-pod (144 R200 in one scale-up domain) is planned for 2026 H2.